Hybrid IC Substrates & Others
KA Hybrid IC
- Adjustment processes are decreased by function and ratio trimmings
- Various types of package are available
- High reliability achieved by KOAs original thick film technology
KLCJ Custom Module
- SMD (Hybrid IC)
- Multiple semiconductors in one package offers downsized system with high performance and standardization
- High precision modules by function trimming
- Terminal pitch: 0.8mm ~
- Mountable device: SMD, bare chip, printed resistor (trimmable)
